摘要
分析了级联金丝拱高、跨距、间距、缝隙、对位精度以及高度差等因素对W波段组件微波特性的影响,给出了W波段微波组件金丝级联工艺关键参数。这些研究结果对W波段微波组件的微波性能有着重要意义,具有重要的参考价值。
The influences of factors such as the arch height,span,spacing,gap,alignment accuracy and height difference of gold wire bonding on the microwave characteristics of the W-band components are analyzed,and the key parameters of the bonding process of the gold wire in the W-band microwave component are given.These research fi ndings are of great signifi cance to the RF performance of W-band microwave components and have important reference value.
作者
程启芬
CHENG Qifen(Mailbox 429,Chadianzi,Chengdu 610036,China)
出处
《电子工艺技术》
2025年第5期60-62,共3页
Electronics Process Technology
关键词
微波组件
金丝键合
W波段
microwave components
gold wire bonding
W-band
