摘要
随着仪器设备微电子封装器件高密度、微型化以及适应极端环境的发展趋势,封装焊点承担的电流密度不断增加,加之电-热-力多场耦合效应,加剧了焊点电迁移失效风险,已经成为影响仪器设备可靠性的关键因素。本文针对封装焊点的电迁移行为,梳理了电迁移的物理机制与损伤机理,阐明了电迁移对焊点力学性能的影响规律,回顾了焊点蠕变本构理论的发展历程,分析了电迁移作用下焊点蠕变本构模型的优势与局限,为深入研究电迁移作用下焊点可靠性评估方法提供理论基础。
As the development of electronic packaging towards high-density,miniaturization and extreme environment adaptability,solder joints are subjected to escalating current densities.In addition,the effect of electro-thermal-mechanical coupled loads exacerbates the risks of electromigration(EM)failure in solder joints,which has become a critical factor in the reliability of instrumentation.In this paper,the physical mechanisms,damage characteristics,mechanical properties and constitutive model of solder joints during electromigration are reviewed comprehensively.The advantages and limitations of constitutive model under electromigration condition are analyzed,which provides a theoretical foundation for advancing reliability evaluation method of solder joints under electromigration conditions.
作者
邢睿思
侯传涛
李尧
程昊
刘宝瑞
XING Ruisi;HOU Chuantao;LI Yao;CHENG Hao;LIU Baorui(Science and Technology on Reliability and Environmental Engineering Laboratory,Beijing Institute of Structure and Environment Engineering,Beijing 100076,China)
出处
《强度与环境》
2025年第4期1-10,共10页
Structure & Environment Engineering
基金
国家自然科学基金(12402077)
重点实验室基金(614200420240202)。
关键词
电子封装
电迁移
损伤机制
力学性能
本构理论
electronic packaging
electromigration
damage mechanism
mechanical properties
constitutive theory
