摘要
To address the inherent trade-off between mechanical strength and repair efficiency in conventional microcapsule-based self-healing technologies,this study presents an eggshell-inspired approach for fabricating high-load rigid porous microcapsules(HLRPMs)through subcritical water etching.By optimizing the subcritical water treatment parameters(OH−concentration:0.031 mol/L,tem-perature:240°C,duration:1.5 h),nanoscale through-holes were generated on hollow glass microspheres(shell thickness≈700 nm).The subsequent gradient pressure infiltration of flaxseed oil enabled a record-high core content of 88.2%.Systematic investigations demonstrated that incorporating 3 wt%HLRPMs into epoxy resin composites preserved excellent dielectric properties(breakdown strength≥30 kV/mm)and enhanced tensile strength by 7.52%.In addressing multimodal damage,the system achieved a 95.5%filling efficiency for mechanical scratches,a 97.0%reduction in frictional damage depth,and a 96.2%recovery of insulation following electrical treeing.This biomimetic microcapsule system concurrently improved self-healing capability and matrix performance,offering a promising strategy for the development of next-generation smart insulating materials.
基金
supported by the National Natural Science Foundation of China(Nos.52377133 and 52077014)
the Youth Talent Support Program of Chongqing(CQYC2021058945)
the General Program of the Natural Science Foundation of Chongqing Municipality(CSTB2022NSCQ-MSX0444).
