摘要
封装基板正面临层数增加、单层厚度减薄、线路密度提高等挑战,导致层间对位精度要求日益严格。提出一种基于中心层基准的新型对准系统,通过减少图形转移累积次数,可显著降低层间偏移。以8层无芯基板为例,理论计算表明:中心层对位系统的最大层偏(21.21μm)较传统逐层对位(39.69μm)降低46.5%。实验通过优化激光烧靶参数和靶标识别算法,解决了深层靶标烧蚀异常和光学对焦问题。实际产品验证显示,该方案在25μm层偏规格下的过程能力指数(C_(pk))稳定高于1.33,满足高密度封装需求。
The packaging substrate design faces challenges including increased layer count,reduced single-layer thickness,and elevated circuit density,leading to progressively stringent requirements for interlayer alignment accuracy.This paper proposes a novel alignment system based on a central reference layer,which significantly reduces interlayer shifts by minimizing the number of pattern transfer accumulations.Taking an 8-layer coreless substrate as an example,theoretical calculations demonstrate that the maximum layer shift(21.21μm)of the central-layer alignment system is reduced by 46.5%compared to conventional sequential alignment(39.69μm).Experimental optimizations of laser ablation parameters and target recognition algorithms resolved issues of abnormal ablation in deep-layer targets and optical focusing challenges.Practical product validation reveals that the proposed solution achieves C_(pk) consistently exceeding 1.33 under a 25μm layer shift specification,meeting high-density packaging requirements.
作者
王厚华
陆然
魏炜
张亚平
张云川
WANG Houhua;LU Ran;WEI Wei;ZHANG Yaping;ZHANG Yunchuang(GreaTech Substrate Co.,Ltd.,Guangzhou 510700,Guangdong,China)
出处
《印制电路信息》
2025年第9期34-38,共5页
Printed Circuit Information
关键词
封装基板
高密度集成
层间偏移
对位
substrate
high⁃density integration
layer shift
alignment
