摘要
多层/立体电路是高性能微电子器件、可穿戴电子设备等的核心基础单元,如何高效稳定制备高分辨率导电互连结构是制备的关键。传统的硅通孔互连、引线键合技术难以简单快速、低成本制备高分辨率的柔性多层导电互连结构。为满足该类电子器件导电互连、小尺寸、快速制备的需求,提出了熔融合金电流体喷印工艺打印制备高分辨率导线和导电互连结构的方法。阐述了该工艺方法的基本原理和工艺验证过程,自主设计了一种新型喷头装置进行实验,研究了脉冲峰值电压、打印速度对导线线宽的影响,同时探究立体互连结构实际高度与设定高度的关系。在脉冲峰值电压为2.4 kV、喷嘴内径为200μm、打印速度为4.5 mm/s的条件下,导电互连结构成型质量最佳,导线平均线宽为63μm,立柱互连结构平均直径为139μm。最后使用优化后的工艺参数成功地在柔性聚二甲基硅氧烷(PDMS)基板上制备了具有双层互连结构的心率监测电路,为快速制备多层互连柔性可穿戴电子设备提供了基于熔融合金电流体喷印技术的制备策略。
Multilayer/stereo circuits are the core basic units of high performance microelectronic devices,portable electronic devices,etc.The key lies in how to efficiently and stably prepare high-resolution conductive interconnection structures.The conventional through silicon via interconnection and wire bonding techniques are difficult to prepare high-resolution flexible multilayer conductive interconnection structures in an easy,fast and cost-effective way.Therefore,in order to meet the demands for conductive interconnection,small size and rapid preparation of this type of electronic devices,a molten alloy electrohydrodynamic jet printing process method was proposed for the preparation of high-resolution wires and conductive interconnection structures.The basic principle and process validation process of this process method were described,and a new type of nozzle device was designed for experiments to study the effects of peak pulse voltage and printing speed on the wire width,as well as to explore the relationship between the actual height of stereo interconnection structures and the setting height.Under the conditions of peak pulse voltage of 2.4 kV,nozzle inner diameter of 200μm,and printing speed of 4.5 mm/s,the conductive interconnection structure has the best molding quality,with an average wire width of 63μm and an average diameter of the column interconnection structure of 139μm.Finally,the optimized process parameters were used to successfully prepare a heart rate monitoring circiut with the double-layer interconnection structure on flexible polydimethylsiloxane(PDMS)substrate,which providing a preparation strategy based on molten alloy electrohydrodynamic jet printing technology for the rapid preparation of flexible wearable electronic devices with multilayer interconnection.
作者
汪方杰
潘艳桥
付爽
杨翊
张峰
Wang Fangjie;Pan Yanqiao;Fu Shuang;Yang Yi;Zhang Feng(Hubei Provincial Key Laboratory of Mechanical Transmission and Manufacturing Engineering,School of Mechanical Engineering,Wuhan University of Science and Technology,Wuhan 430081,China;Precision Manufacturing Research Institute,School of Mechanical Engineering,Wuhan University of Science and Technology,Wuhan 430081,China;Key Laboratory of Metallurgical Equipment and Control of Ministry of Education,School of Mechanical Engineering,Wuhan University of Science and Technology,Wuhan 430081,China)
出处
《微纳电子技术》
2025年第9期133-140,共8页
Micronanoelectronic Technology
基金
国家自然科学基金(12102311)
智能制造装备与技术全国重点实验室开放课题基金(IMETKF2023010)
湖北省自然科学基金面上项目(2025AFB507)。
关键词
导电互连结构
熔融合金电流体喷印
高分辨率
电子电路
工艺优化
conductive interconnection structure
molten alloy electrohydrodynamic jet printing
high-resolution
electronic circuit
process optimization
