摘要
附着力低是目前压敏电阻用铜浆存在的主要问题。笔者研究了玻璃化学成分、球磨时间、球石与玻璃粉比例、玻璃粉粒度对铜浆的影响。结果表明,选择合适的玻璃化学成分和合适的玻璃粉粒度是制备合格铜浆的关键因素。选用合适配方的玻璃粉,玻璃粉的粒度控制在d50=1.5μm±0.5μm,玻化温度控制在520℃±5℃,软化温度控制在440℃±10℃,制备的铜浆各项指标符合要求,可以用于产品生产。
Low adhesion is the main problem of copper paste used in varistor.The effects of chemical composition of glass,milling time,ratio of stone to glass powder and particle size of glass powder on copper paste were studied.The results show that suitable glass chemical composition and particle size are the key factors for preparing qualified copper paste.Select the appropriate formula of glass powder,glass powder particle size is controlled at d50=1.5μm±0.1μm,vitrified temperature is controlled at 520℃±5℃,softening temperature is controlled at 440℃±10℃,the prepared copper paste indicators meet requirements,which can be used in production.
作者
李东明
杨佩嘉
李宏杰
杨清帅
孙锐娟
LI Dongming;YANG Peijia;LI Hongjie;YANG Qingshuai;SUN Ruijuan(School of Science,Xi'an Shiyou University,Xi'an 710065,China;Xi'an Chuanglian Optoelectronic New Materials Co.,Ltd.,Xi'an 710065,China)
出处
《电瓷避雷器》
2025年第4期59-64,共6页
Insulators and Surge Arresters
基金
陕西省重点研发计划项目(编号:2018GY-062)。
关键词
铜浆
无铅电子玻璃粉
附着力
粒度
玻化温度
copper paste
lead-free electronic glass powder
adhesion force
granularity
vitrified temperature
