摘要
采用放电等离子烧结(SPS)技术制备了Cu/AlN/Cu功能梯度电极材料,并成功实现了与CoSb_(3)热电材料的高效连接。通过扫描电镜(SEM)和能谱分析(EDS),在Cu/AlN/Cu与CoSb_(3)的界面处检测到Cu_(3)Sb、Cu_(3.3)Sb、(Ag,In)、Cu、CuIn及Cu2In等多种物相,这些相的分布与局部元素分布高度吻合。研究表明,焊接温度显著影响过渡层的结构和均匀性,较低的焊接温度(500℃)有利于形成均匀稳定的过渡层,减少孔洞生成,提升界面连接质量。此外,Cu、Ag、In、Ti等元素在界面区域展现出复杂的扩散行为,尤其是Ti元素的偏析,显著增强了界面的润湿性和结合强度。然而,不对称的扩散速率引发了Kirkendall效应,进一步影响了过渡层的微观结构。X射线衍射(XRD)结果显示,SPS连接后界面处相结构连续,缺乏明显的界面分界线。
Cu/AlN/Cu functionally graded electrode materials were fabricated via spark plasma sintering(SPS)technology in this study and successfully achieved high-efficient bonding with CoSb_(3) thermoelectric materials.Scanning electron microscopy(SEM)and energy-dispersive spectroscopy(EDS)analyses identified multiple phases at the Cu/AlN/Cu-CoSb_(3) interface,including Cu_(3)Sb,Cu_(3.3)Sb,(Ag,In),Cu,CuIn,and Cu2In,with phase distributions closely corresponding to local elemental distributions.The findings demonstrate that welding temperature significantly affects the structure and uniformity of the transition layer;a lower welding temperature(500℃)favors the formation of a homogeneous and stable transition layer,reduces pore formation,and enhances interface bonding quality.In addition,Cu,Ag,In,and Ti exhibited complex diffusion behaviors in the interface region.Notably,Ti segregation substantially improved interface wettability and bonding strength.However,asymmetric diffusion rates induced the Kirkendall effect,further affecting the microstructure of the transition layer.X-ray diffraction(XRD)analyses revealed that the interface phase structure remained continuous after SPS bonding,with no distinct boundary observed.
作者
孙静
罗洁
吕薪羽
张宗仁
SUN Jing;LUO Jie;LYU Xinyu;ZHANG Zongren(Jilin Vocational College of Industry and Technology,Jilin 132013,China)
出处
《中国陶瓷》
北大核心
2025年第8期31-37,共7页
China Ceramics
基金
吉林工业职业技术学院科研课题“金属与陶瓷梯度复合热电电极的制备及其与热电材料连接的研究”(25KY06KJY)。
