摘要
超导量子芯片因其与半导体工艺兼容性强,可扩展潜力大,易于操控、读取与耦合,现阶段被认为是最有希望实现可扩展通用量子计算机的技术路线之一。当前,随着超导量子技术的进一步发展,其在退相干时间、门保真度和中等规模扩展上均取得了重要的突破。然而,随着芯片中集成的量子比特数目的不断增加,量子比特集成化技术成为未来重点的研究的重点。本文从超导量子芯片的集成工艺出发,主要分析倒装焊(Flip-chip)、硅通孔(TSV)和“3D”堆叠工艺在超导量子芯片上的研究进展,对工艺需要解决的主要技术瓶颈进行了分析,同时对未来发展趋势进行了展望。
Superconducting chips represent one of the most promising technological pathways toward realizing scalable,universal quantum computers owing to their strong compatibility with semiconductor fabrication processes,high scalability potential,and ease of qubit manipulation,readout,and coupling.In recent years,substantial progress has been made in enhancing decoherence times,gate fidelity,and medium-scale expansion within the field of superconducting quantum technology.However,as the number of qubits continues to grow,large-scale qubit integration has become increasingly critical.This paper analyzes key integration technologies,including flip-chip bonding,through-silicon vias,and"3D"stacking techniques,for superconducting quantum chips.It also discusses the main technical challenges that must be addressed.Finally,the paper offers an outlook on the development trends of these integration technologies.
作者
栾添
刘鑫
代志鹏
李泽东
王维
李成鑫
LUAN Tian;LIU Xin;DAI Zhipeng;LI Zedong;WANG Wei;LI Chengxin(Yangtze Delta Region Industrial Innovation Center of Quantum and Information Technology,Suzhou Jiangsu,215100,P.R.China;Tianjian Talent Development Center of the Second Institute of China Aerospace Science and Technology Corporation,Beijing 100854,P.R.China;China Academy of Electronics and Information Technology,Beijing 100041,P.R.China)
出处
《微电子学》
北大核心
2025年第3期430-440,共11页
Microelectronics
基金
姑苏创新创业领军人才计划“面向傅里叶变换的专用量子处理器产品研发和产业化”(ZXL2022424)。
关键词
倒装焊
硅通孔
“3D”堆叠
芯片集成
flip-chip
through-silicon via
"3D"stacking
chip integration
