摘要
通过增加线宽和覆铜厚度提升载流能力的方式,难以解决印制电路板(PCB)局部发热问题。行业内常用的焊接铜排方案也存在诸如散热性能差、连接稳定性不足等弊端。为此,提出了PCB埋铜排方法,即通过特定工艺将铜排埋入PCB内部,实现铜排与基板一体化压合。测试结果表明,铜排与基板的结合强度高,抗拉和抗扭性能均好于设计要求,其嵌入结构的强度优于基板自身承载能力。该方法改善了传统焊接铜排方式在电流承载能力、散热能力及稳定性方面的不足,提升了PCB产品的可靠性与稳定性。
Limited by substrate characteristics,the conventional approach of enhancing the current-carrying capacity of printed circuit board(PCB)by increasing trace width and copper cladding thickness fails to effectively address local heating issues.The industry's commonly adopted welded copper busbar solution also suffers from drawbacks such as poor heat dissipation performance and insufficient connection stability.To tackle these challenges,this paper presents a PCB embedded copper busbar method,which embeds the copper busbar within the PCB through specific processes to achieve integrated pressing of the copper busbar and circuit board.Test results demonstrate that the bonding strength between the copper busbar and substrate is high,with tensile force and torque both exceeding design requirements,indicating that the strength of the embedded structure surpasses the substrate's own load-bearing capacity.This method overcomes the shortcomings of traditional welded copper busbar solutions in current-carrying capacity,heat dissipation,and stability,thereby enhancing product reliability and stability.
作者
陈水灵
CHEN Shuiling(Ganzhou Chaoyue Technology Co.,Ltd.,Ganzhou 341007,Jiangxi,China)
出处
《印制电路信息》
2025年第8期33-36,共4页
Printed Circuit Information
关键词
印制电路板
铜排
一体化成型
printed circuit board(PCB)
copper bar
integrated molding
