摘要
普通树脂塞孔加工方法由于设备及工艺的限制,最大塞孔孔径仅为0.8 mm,且孔径越大,树脂凹陷和填孔不实的风险越大。为此,通过优化加工流程和工艺设计,提出了在树脂塞孔前贴附导气模板的加工新方法。观察采用新方法塞孔后的树脂表面及孔内形貌,发现新方法可确保塞孔饱满,无明显缺陷。可靠性试验结果显示,新方法塞孔后的树脂无裂纹、孔壁无分离,满足客户使用要求。该新方法操作简单,能满足大孔径树脂塞孔的加工需求,可为印制电路板制造中成品板厚大于1.00 mm、塞孔孔径小于2.35 mm的树脂塞孔工艺优化提供新的思路。
Due to equipment and process limitations,the maximum plugging capability of ordinary resin plugging is only 0.8 mm.The larger the hole diameter,the higher the risk of resin sagging and incomplete filling.By optimizing the processing flow and process design,a new processing method of attaching a gas guide template before resin plugging is proposed.Observing the resin surface and hole morphology after plugging,it is found that this method can ensure full plugging without obvious defects.Reliability test results show that there are no cracks in the resin and no separation on the hole wall,meeting customer requirements.This process method is simple to operate and can meet the processing needs of large-diameter resin plugging.It provides a new idea for resin plugging process in printed circuit board manufacturing where the finished board thickness is greater than 1.00 mm and the plugging hole diameter is less than 2.35 mm.
作者
林毅明
温滨
井维萧
刘兴文
杨朝志
LIN Yiming;WEN Bin;JING Weixiao;LIU Xingwen;YANG Chaozhi(Chengdu Space Communication Equipment Co.,Ltd.,Chengdu 610052,Sichuan,China)
出处
《印制电路信息》
2025年第8期29-32,共4页
Printed Circuit Information
关键词
印制电路板
树脂塞孔
工艺优化
printed circuit board(PCB)
resin plug hole
large hole diameter
