摘要
利用分子动力学模拟方法,探究了熔融AgCuTi在TiNi合金表面上的润湿铺展行为.研究了同温度为1 073,1 123,1 173 K和1 223 K,AgCuTi钎料分别在单晶和多晶TiNi合金表面上的润湿行为.通过分析密度分布和模拟平衡状态的润湿铺展图像,发现温度的升高对润湿过程有明显的促进.在润湿过程中未观察到明显的溶解反应,反而形成了由Ag主导的前驱膜,而随着温度的升高熔融AgCuTi中也有少量的Cu和Ti扩散到TiNi基体中,同时基体中的少量Ti也向钎料中扩散.通过分析均方位移,发现前驱膜的形成面积随着温度的升高也相应增大.液滴的润湿铺展呈现各向同性,形成规整的圆形铺展区域.通过分析熔融AgCuTi在单晶基体和多晶基体上的润湿特性,发现晶界的存在会对润湿铺展过程有显著的促进.
The wetting and spreading behavior of molten AgCuTi on the surface of TiNi alloy was investigated using the molecular dynamics simulation method.The wetting behavior of AgCuTi brazing alloy on the surface of single-crystal and polycrystalline TiNi alloys at different temperatures of 1073,1123,1173 K,and 1223 K was investigated.By analyzing the density distribution and simulating the wetting and spreading image in the equilibrium state,it was found that the increase in temperature had a significant promotion on the wetting process.No obvious dissolution reaction was observed during the wetting process.Instead,a precursor film dominated by Ag was formed.As the temperature increased,a small amount of Cu and Ti diffused into the TiNi matrix in the melted AgCuTi,and a small amount of Ti in the matrix diffused into the brazing alloy.By analyzing the mean square displacement,it was found that the formation area of the precursor film increased correspondingly with the increase in temperature.The wetting and spreading of droplets exhibited isotropy,forming a regular circular spreading area.By analyzing the wetting properties of molten AgCuTi on single-crystal and polycrystalline substrates,it was found that the presence of grain boundaries significantly promoted wetting properties.surface of TiNi alloy was revealed.
作者
李玉龙
阎申
涂冰
雷敏
LI Yulong;YAN Shen;TU Bing;LEI Min(Jiangxi Key Laboratory of Intelligent Robot,School of Advanced Manufacturing,Nanchang University,Nanchang,330031,China;Chongqing Research Institute of Nanchang University,Chongqing,402660,China)
出处
《焊接学报》
北大核心
2025年第7期15-22,共8页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(52065043,52105354)
江西省双千计划科技创新高层次人才项目(jxsq2019201048)
重庆市自然科学基金资助项目(CSTB2022NSCQ-MSX1346,CSTB2023NSCQ-MSX1047)。
