摘要
现场可编程门阵列(Field Programmable Gate Array,FPGA)芯片因其体积小、能耗低、性能好和可反复编程等优点已成为电子系统设计的主流。随着芯片复杂度和集成度越来越高,对于电子元器件的可靠性试验和筛选的要求也越来越高,FPGA的测试需求变得尤为迫切。以Xilinx公司的XC7VX690T系列FPGA芯片为研究对象,以“分治法”和“一维阵列”为基本测试思路,对该FPGA芯片可编程逻辑模块(CLB)和输入输出模块(IOB)的内部结构和功能特性进行深入分析和探讨,并通过在Advantest公司V93000自动测试设备上实现最大矢量深度扩展,验证了所提出的测试方法的可行性。
The Field Programmable Gate Array(FPGA)chips have become mainstream in electronic system design due to their small size,low power consumption,excellent performance,and reprogrammability.As the complexity and integration of chips continue to increase,the demands for reliability testing and screening of electronic components are also rising,making the testing requirements for FPGAs particularly urgent.This study focuses on the Xilinx XC7VX690T series FPGA chip and employs a“divide-and-conquer”approach along with a"one-dimensional array"as the basic testing strategy,which conducts an in-depth analysis and discussion of the internal structures and functional characteristics of the modules of the FPGA chip:the Configurable Logic Blocks(CLB)and Input/Output Blocks(IOB).Additionally,the feasibility of the proposed testing methods is verified by implementing maximum vector depth expansion on the Advantest V93000 automatic test equipment.
作者
安翔
黄健
李岱林
陈诚
王建超
AN Xiang;HUANG Jian;LI Dai-lin;CHEN Cheng;WANG Jian-chao(China Key System&Integrated Circuit Co.,Ltd.)
出处
《中国集成电路》
2025年第7期73-77,共5页
China lntegrated Circuit
