摘要
本文主要研究了大孔内层独立焊盘的扯出问题及其改善措施。本文开展了一系列优化测试方案,包括调整内层焊盘的尺寸、预钻方式以及钻孔参数等。实验结果表明,增大内层焊盘尺寸后,其内层焊盘抗拉强度上有显著改善,能够有效提高生产良率。此外,经继续研究发现了增加预钻孔数和分段钻的加工工艺对改善焊盘内层拉脱和孔壁质量都有改善作用。
This paper mainly studies the problem of pulling out the inner layer independent pad of large hole and its improvement measures.In this paper,a series of optimization test schemes are carried out,including adjusting the size of the inner layer pad,pre-drilling mode and drilling parameters.The experimental results show that the tensile strength of the inner layer pad can be improved significantly after the size of the pad is increased,and the yield can be effectively increased.In addition,it is also found that increasing the number of pre-drilling holes and the processing technology of segmenting drilling can prevent the pull out of the inner layer pad and hole wall quality.
作者
郭茂桂
叶圣涛
许伟廉
陈世金
洪延
Guo Maogui;Ye Shengtao;Xu Weilian;Chen Shijin;Hong Yan
出处
《印制电路资讯》
2025年第4期71-74,共4页
Printed Circuit Board Information
关键词
PCB
大孔
钻孔
内层焊盘
抗拉强度
预钻
分段钻
PCB
Large hole
Drilling
Inner layer independent PAD
Tensile strength
Pre-drilling
Segmenting drilling
