摘要
针对印刷电路板化学镀锡液稳定性较差,研究对苯二酚和抗坏血酸两种稳定剂添加对镀锡层的电化学行为和表面形貌的影响。采用扫描电子显微镜(SEM)分析了不同浓度稳定剂时化学下镀锡层的表面形貌,通过电化学工作站的Tafel极化曲线和电化学阻抗谱来对比镀层的耐蚀性。结果表明:在稳定剂加入后,所得镀层的表面平整,无明显孔洞、裂纹。原镀液的腐蚀电流密度为2.865μA/cm^(2)。随着对苯二酚和抗坏血酸浓度由1 g/L增加至5 g/L,镀锡层的腐蚀电流密度分别由12.147μA/cm^(2)降到6.627μA/cm^(2)和34.064μA/cm^(2)降到3.557μA/cm^(2),随稳定剂含量增加,镀层耐蚀性有增强的趋势。5 g/L对苯二酚和抗坏血酸添加时,化学镀锡层的电荷转移电阻分别为2424.0和3212.0Ω·cm^(2)。
In view of the poor stability of the chemical tin plating solution for printed circuit boards,the effects of the addition of two types of stabilisers,hydroquinone and ascorbic acid,on the electrochemical behaviour and surface morphology of tin plated layers were investigated.Scanning electron microscopy was used to analyse the surface morphology of tin plating layers with different concentrations of stabilisers,and the corrosion resistance of the plated layers was compared with the Tafel polarisation curves and electrochemical impedance spectra of the electrochemical workstation.The results show that there are no obvious holes and cracks on the surface of the resulting plated layer after the addition of stabilisers.The corrosion current density of the original plating solution was 2.865μA/cm^(2).As the concentration of hydroquinone and ascorbic acid increased from 1 g/L to 5 g/L,the corrosion current density of the tin plated layer decreased from 12.147μA/cm^(2)to 6.627μA/cm^(2)and from 34.064μA/cm^(2)to 3.557μA/cm^(2),respectively.The charge transfer resistance of the chemically tinned layer was 2424.0 and 3212.0Ω·cm²for 5 g/L hydroquinone and ascorbic acid additions,respectively.
作者
杨义华
张璟睿
洪杰
邓向
刘光明
文明立
王鹏
Yang Yihua;Zhang Jingrui;Hong Jie;Deng Xiang;Liu Guangming;Wen Mingli;Wang Peng(Jian Hongdaqiu Technology Co.,Ltd.,Jian 343900,China;Nanchang Hangkong University,Nanchang 330063,China)
出处
《广东化工》
2025年第12期41-43,共3页
Guangdong Chemical Industry
关键词
化学镀锡
稳定剂
对苯二酚
抗坏血酸
耐腐蚀性
chemical tinning
stabilizers
hydroquinone
ascorbic acid
corrosion resistance
