摘要
本文以硅基有机电致发光OLED微型显示器生产中的玻璃片封装技术为研究对象,研究了热固化和紫外光固化两种固化技术对玻璃片封装技术可靠性的影响,并从玻璃片封装的效率、对齐精度、粘接强度、环境老化缺陷,光电性能等方面对两种封装技术进行了对比。结果表明:紫外光固化玻璃片封装技术在生产效率、对齐精度、粘接强度、环境老化缺陷方面均优于热固化方式,而在光电性能方面差别较小。
Glass packaging is a critical component in the production of silicon-based organic electroluminescent organic light-emitting diode(OLED)microdisplays.This study investigates the impact of two curing methods—thermal curing and UV curing—on the reliability of glass encapsulation technology.Key parameters,such as encapsulation efficiency,alignment precision,bonding strength,resistance to environmental aging,and photoelectric performance,were evaluated for both encapsulation systems.Consequently,the UV-curing glass encapsulation outperforms thermal curing in terms of resistance to environmental aging,bonding strength,alignment precision,and manufacturing efficiency.However,the difference in photoelectric performance between the two methods is negligible.
作者
周芳
王光华
周允红
段谦
谢虹忆
杨炜平
金景一
孙伟杰
左俐娜
施梅
ZHOU Fang;WANG Guanghua;ZHOU Yunhong;DUAN Qian;XIE Hongyi;YANG Weiping;JIN Jingyi;SUN Weijie;ZUO Lina;SHI Mei(Yunnan Olightek Opto-electronic Technology Co.,Ltd.,Kunming 650223,China;Kunming Institute of Physics,Kunming 650223,China)
出处
《红外技术》
北大核心
2025年第6期779-784,共6页
Infrared Technology
