摘要
纯钽的组织和织构会影响电子工业用钽靶的性能,为明确纯钽锻造过程中微观组织和织构的演变特征,在液压机上对电子束熔炼的纯钽进行锻造变形,随后进行1050℃退火处理,采用背散射衍射和显微硬度技术系统研究锻造次数(1~3次)对纯钽微观组织、织构、再结晶率及硬度的影响。结果表明:1次锻造退火后的纯钽组织粗大且再结晶率较低,仅为72%;随着锻造次数的增加,纯钽的平均再结晶晶粒尺寸逐渐减小,再结晶率逐渐增加。3次锻造退火后,纯钽内部形成了强烈的{111}<uvw>织构,并且{111}晶粒占比达39.7%。维氏硬度随着锻造次数的增加而增大,3次锻造退火后的平均硬度值达到101.3 HV。
The microstructure and texture of pure tantalum can affect the performance of tantalum target used in the electronics industry,therefore,in order to clarify the evolution characteristics of the microstructure and texture during the forging process of pure tantalum,the pure tantalum melted by electron beam was forged on a hydraulic press and then annealed at 1050℃.Then,the influences of forging pas-ses(1-3 passes)on the microstructure,texture,recrystallization rate and hardness of pure tantalum were systematically investigated by backscattered diffraction and microhardness techniques.The results show that the pure tantalum has a coarse microstructure and a low re-crystallization rate of only 72%after one pass forging and annealing.With the increasing of forging pass,the average recrystallized grain size of pure tantalum gradually decreases and the recrystallization rate gradually increases.After three passes forging and annealing,a strong{111}<uvw>texture is formed inside the pure tantalum,and{111}grain accounts for 39.7%.The Vickers hardness increases with the increasing of forging pass,and the average hardness value after three passes forging and annealing reaches 101.3 HV.
作者
吴昊
贾志强
陈昊
张龙
Wu Hao;Jia Zhiqiang;Chen Hao;Zhang Long(Xi′an Noble Rare Metal Materials Co.,Ltd.,Xi′an 710201,China)
出处
《锻压技术》
北大核心
2025年第6期42-47,共6页
Forging & Stamping Technology
基金
国家重点研发计划(2018YFC1901704)。
关键词
纯钽
锻造次数
微观组织
织构
维氏硬度
pure tantalum
forging pass
microstructure
texture
Vickers hardness
