摘要
半导体光刻胶是制造芯片最关键的材料,具备高技术、高设备、高客户和高原材料的众多壁垒特点。在量子信息、5G通信、人形机器人、人工智能、智能驾驶等领域的推动下,集成电路的应用广度和深度也在不断扩大,进而晶圆的需求持续增长,半导体光刻胶行业也迎来机遇。本文概括介绍了半导体光刻胶的工艺原理及常见分类,重点研究了全球半导体光刻胶产业现状、竞争格局,并对半导体光刻胶产业未来的发展趋势进行了预测和判断。
Semiconductor photoresist is the most critical material for manufacturing chips,with characteristics of high technological barriers,high equipment barriers,high customer barriers,and high-altitude material barriers.Driven by fields such as quantum information,5G communication,humanoid robots,artificial intelligence,and intelligent driving,the application breadth and depth of integrated circuits are constantly expanding,and the demand for integrated circuits continues to grow.The semiconductor photoresist industry is also facing opportunities.This article provides an overview of the process principles and common classifications of semiconductor photoresist,with a focus on the current status and competitive landscape of the global semiconductor photoresist industry.It also predicts the future development trends of the semiconductor photoresist industry.
作者
冯国楠
沈锦璐
李建慧
张卓
杨淑娴
刘亦玮
FENG Guo-nan;SHEN Jin-lu;LI Jian-hui;ZHANG Zhuo;YANG Shu-xian;LIU Yi-wei(China Center for Information Industry Development)
出处
《中国集成电路》
2025年第5期10-14,共5页
China lntegrated Circuit
关键词
半导体
光刻胶
产业现状
发展趋势
semiconductor
photoresist
industry status
development trend
