摘要
印制电路板(PCB)的防焊油墨半塞孔最大孔径制程能力一般为0.4 mm。当半塞孔孔径要求>0.4 mm时,传统的油墨塞孔加工方式及物料选用无法同时满足其密封性和可焊接性的要求。目前,部分高端游戏机主板客户,不但设计有0.5 mm的半塞孔,还对其焊接性和半塞孔孔口油厚提出严格要求。通过对半塞孔面次、半塞孔油墨、半塞孔后整平方式及生产参数进行优化设计,从根源上改善0.5 mm半塞孔的透光、孔口积墨、冒油等品质问题,以达到客户的品质要求。
The maximum aperture process capability for partial via plugging with solder resist ink on printed circuit boards(PCBs)is typically 0.4mm.When the partial via aperture requirement exceeds 0.4mm,traditional ink plugging processes and material selections fail to simultaneously meet both sealing reliability and solder ability requirements.However,some high-end gaming console motherboard clients currently demand 0.5 mm partial via designs while imposing strict requirements on solderability and ink thickness at via openings.Focuses on root-cause improvements for quality issues such as light transmission,ink accumulation at via openings,and ink bleeding in 0.5 mm solder resist partial vias.Through optimized design of plugging surface treatments,via fill ink selection,postplugging planarization methods,and production parameters,the research aims to achieve client quality specifications.
作者
杨国勇
伍胜玉
尚先荣
杨超
王先贵
YANG Guoyong;WU Shengyu;SHANG Xianrong;YANG Chao;WANG Xiangui(Victory Giant Technology(Hui Zhou)Co.,Ltd.,Huizhou 516211,Guangdong,China)
出处
《印制电路信息》
2025年第6期26-29,共4页
Printed Circuit Information
关键词
防焊油墨半塞孔
孔口积墨
阻焊
工艺管控
semi⁃plug hole for solder resist ink
Ink accumulation at the orifice
solder mask
process control
