摘要
开发一种聚酰亚胺基光敏树脂,采用紫外光固化成型可大大增加材料的加工自由度,使其作为低介电介质材料在5G通讯领域有广泛的应用。文中对聚酰亚胺进行结构设计,向其链中引入羟基、醚键、三氟甲基及二氮杂萘酮结构,能在改善其溶解性的同时保持良好的耐热性。进一步利用酰氯化反应使含羟基聚酰亚胺接枝丙烯酸酯基团得到光敏聚酰亚胺(PSPI),将其与稀释单体、引发剂等组分复配得到光敏树脂体系,调节体系中PSPI的含量,探究了PSPI含量对系列光敏树脂固化膜综合性能的影响。结果表明,系列固化膜具有良好的耐热性能和力学性能。其玻璃化转变温度(Tg)在181~198℃之间,拉伸强度在53.75~62.61 MPa之间,断裂伸长率在6.93%~10.42%之间。同时在介电性能方面,其介电常数和介电损耗(@20 GHz)最低分别为2.52与0.0110。
The development of polyimide-based photosensitive resin that can be molded by UV curing greatly increases the processing freedom of material.Polyimide-based photosensitive resins have great potential as low dielectric material in the field 5G communication.To design the structure of polyimide,hydroxyl groups,ether bonds,trifluoromethyl groups,and diazanaphthone structures were introduced into its chains to improve its solubility while maintaining good heat resistance.The hydroxyl-containing polyimide was further grafted with acrylate groups by chlorination reaction to obtain photosensitive polyimide(PSPI).For obtaining a photosensitive resin system,PSPI was compounded with diluted monomers,initiators,and other components.Then,the effect of PSPI content on the comprehensive performance of the series of photosensitive resin curing films was explored.The results show that PSPIs possess good heat resistance and mechanical properties.The glass transition temperatures(Tg)of PSPIs ranges from 181℃to 198℃,the tensile strength ranges from 53.75 MPa to 62.61 MPa,and the elongation at break ranges from 6.93%to 10.42%.Meanwhile,the dielectric constant and dielectric loss(@20 GHz)are as low as 2.52 and 0.0110,respectively.The results indicate that there is a great potential for such novel polyimide-based photosensitive resins.
作者
王晓旭
宗立率
张广胜
姜玲梅
李战胜
王锦艳
蹇锡高
Xiaoxu Wang;Lishuai Zong;Guangsheng Zhang;Lingmei Jiang;Zhansheng Li;Jinyan Wang;Xigao Jian(Department of Polymer Materials,School of Chemical Engineering,Dalian University of Technology,Dalian 116024,China;Technology Innovation Center of High Performance Resin Materials,Dalian 116012,China)
出处
《高分子材料科学与工程》
北大核心
2025年第3期1-9,共9页
Polymer Materials Science & Engineering
基金
国家自然科学基金-面上基金项目(52273065)
中央高校基本科研业务费(DUT24GF303)。
关键词
聚酰亚胺
光敏树脂
耐热性能
力学性能
介电常数
polyimide
photosensitive resin
heat resistance
mechanical properties
dielectric constant
