摘要
随着AI领域快速发展,市场对高性能的服务器需求快速增长,推动服务器类PCB向高集成度、高速率、低延迟及更可靠的应用需求升级。高端服务器类PCB产品的球栅阵列(BGA)区域布设数量及其布线密集程度越来越高。BGA区域在电镀过程常常因其电镀效率较大铜面偏低,导致在BGA区域镀铜厚与大铜面镀铜厚度极差加大,增加后制程蚀刻难度。本文通过脉冲电镀机理研究,优化波形设计,提高孔口位置镀铜厚度,有效改善BGA区域电镀效率,满足高性能服务器对PCB产品日益增长的需求。
With the rapid development of the AI field,the market demand for high-performance servers is growing rapidly,driving the upgrade of server-class PCB applications to high integration,high speed,low latency,and more reliable.The number of BGA areas and the density of routing in high-end server-class PCB products are increasingly high.In the electroplating process,the electroplating efficiency of BGA areas is often lower than that of the large copper surface,resulting in a widening of the gap between the thickness of copper plating in the BGA area and the thickness of copper plating on the large copper surface,increasing the difficulty of subsequent process etching.In this paper,the pulse electroplating mechanism is studied,and the waveform design is optimized to improve the copper plating thickness at the hole position,effectively improving the electroplating efficiency of the BGA area and meeting the growing demand for high-performance server PCB products.
作者
黄军立
王景贵
谢明运
Huang Junli;Wang Jinggui;Xie Mingyun(DELTON TECHNOLOGY(GUANGZHOU)INC.,Guangzhou 510730,Guangdong,China)
出处
《印制电路信息》
2025年第S1期154-158,共5页
Printed Circuit Information
基金
广州市黄埔区中国科学院科技服务网络计划(STS)项目(STS-HP-202309)
关键词
球栅阵列(BGA)
铜厚
电镀效率
脉冲波形
Ball Grid Array(BGA)
Copper Thickness
Plating Efficiency
Pulse Waveform
