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智能穿戴设备用超薄带凹槽PCB制作技术研究

Research on ultra-thin PCB fabrication technology with notch for smart wearable devices
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摘要 智能穿戴设备市场近年来呈现出快速增长的趋势,随着消费者对健康监测、通讯便捷性以及个性化体验需求的不断提升,超薄电路板作为智能穿戴设备的核心组件之一,其发展也日益受到重视。本研究以一款超薄带凹槽PCB产品为例,探索该类产品的相关技术难点和解决方案,通过对其深入研究,希望能提升超薄带凹槽PCB在智能穿戴设备应用中的性能和适配性,为智能穿戴设备的高质量发展提供技术支撑。 The smart wearable device market has shown a rapid growth trend in recent years.As consumers'demand for health monitoring,communication convenience,and personalized experience continues to rise,the development of ultra-thin circuit boards,as one of the core components of smart wearable devices,is also receiving increasing attention.This study takes an ultra-thin notched PCB product as an example to explore the technical difficulties and solutions related to this type of product.Through its in-depth study,it is hoped that the performance and adaptability of ultra-thin notched PCBs in the application of smart wearable devices can be improved,and technical support can be provided for the highquality development of smart wearable devices.
作者 郑文浩 邹金龙 叶大杰 柳小华 刘飞艳 Zheng Wenhao;Zou Jinlong;Ye Dajie;Liu Xiaohua;Liu Feiyan(Jiangmen Suntak Circuit Technology Ltd.,Guangdong Intelligent Industrial Control PCB Engineering,Technology Research and Development Center,Jiangmen 529000 Guangdong China)
出处 《印制电路信息》 2025年第S1期79-84,共6页 Printed Circuit Information
关键词 智能穿戴 超薄 凹槽 激光开盖 可靠性 Smart Wearable Ultra-Thin Notch Laser Cap Opening Reliability
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