期刊文献+

高强低介电光敏树脂的制备及性能

Preparation and Properties of High Strength and Low Dielectric Photosensitive Resin
在线阅读 下载PDF
导出
摘要 文中以不同质量的1-(哌啶-1-基)-2-丙烯-1-酮(PPEO)、1,9-壬二醇二丙烯酸酯(NDDA)、甲基丙烯酸三环癸-8-基酯(DPMA)、异氰脲酸酯三-2-羟乙基三甲基丙烯酸酯(THEITMA)及聚乙二醇二丙烯酸酯(PEGDA)通过共混制得系列光敏树脂油墨。通过UV固化将油墨固化成膜。预聚物PEGDA加入量为10%时,固化后的膜玻璃化转变温度最高可达到198℃,氮气中热失重温度可达到388℃;PEGDA质量分数为10%时,力学性能最优,达到53 MPa。当PEGDA质量分数为20%时,由于C—H键结构数量的增加,使得介电常数下降,在20 GHz频率环境下介电常数最低降至2.83。PEGDA的质量分数由5%增加20%时,油墨黏度由41 mPa·s降低至32 mPa·s,在0~200 s^(-1)剪切速率下树脂油墨表现出牛顿流体的性质,适配喷墨3D打印工艺。这些结果表明,PEGDA系列光敏油墨综合性能优异,在微电子材料领域具有较高的应用价值。 In this paper,a series of photosensitive resin inks were produced by blending of 1-(piperidin-1-yl)-2-propen-1-one(PPEO),1,9-nonanediol diacrylate(NDDA),tricyclo[5.2.1.02,6]deca-8-yl methacrylate(DPMA),tri-2-hydroxyethyl trimethacrylate of isocyanuric acid(THEITMA)and poly(ethylene glycol)diacrylate(PEDGA).The inks were cured by UV curing to result in a thin robust film.When the prepolymer PEGDA mass fraction is 5%,the cured sample exhibits the maximum glass transition temperature for 198℃and a thermal decomposition temperature in nitrogen for 388℃.When the mass fraction of PEGDA reaches 10%,the tensile stress reveals the highest value of 53 MPa.When the mass friction of PEGDA is increased to 20%,the increase of number of C—H bonding structures results in a decrease in dielectric constant with the lowest value for 2.83 at 20 GHz.With PEGDA loading ranged 5%to 20%,the viscosity of the ink decreases from 41 mPa·s to 32 mPa·s,with a typical nature of Newtonian Fluid at the shear rate of 0~200 s^(-1)simultaneously.These results indicate that the PEGDA series of photosensitive inks have excellent comprehensive performance and commendable application value in microelectronic and other high-tech communication fields.
作者 孙浩 姜玲梅 张广胜 宗立率 王锦艳 蹇锡高 Hao Sun;Lingmei Jiang;Guangsheng Zhang;Lishuai Zong;JinyanWang;Xigao Jian(School of Chemical Engineering,Dalian University of Technology,Dalian 116024,China;State Key Laboratory of Fine Chemicals,Dalian University of Technology,Dalian 116024,China;Technology Innovation Center of High Performance Resin Materials,Dalian 116024,China)
出处 《高分子材料科学与工程》 北大核心 2025年第1期1-9,共9页 Polymer Materials Science & Engineering
关键词 力学性能 低黏度 低介电常数 光敏油墨 聚乙二醇二丙烯酸酯 mechanical properties low viscosity low dielectric constant photosensitive inks poly(ethylene glycol)diacrylate
  • 相关文献

参考文献4

二级参考文献42

  • 1王淑芬.无人机发展的情报研究[J].飞航导弹,1998,(10):1-5.
  • 2Robert C Michelson. Enabling technology for UAVs[A].The flight vehicle integration panel specialists′ meetings held in Ankara,Turkey[C].Ankara,1995.111-118.
  • 3陈民锋.ACT器件原理及应用[A].信息产业部雷达专业情报网第十四届年会论文集[C].南京,2001.61-68.
  • 4Le H P.J.Imaging Sci.Technol.,1998,42:49.
  • 5Kang H R.J.Imaging Sci.,1991,35:179.
  • 6de Gans B J,Duineveld P C,Schubert U S.Adv.Mater.,2004,16:203.
  • 7Sun X D,Wang K A,Yoo Y,et al.Adv.Mater.,1997,9:1046.
  • 8Sabnis R W.Displays,1999,20:119.
  • 9Holdcroft S.Adv.Mater.,2001,13:1753.
  • 10Pede D,Serra G,De Rossi D.Mater.Sci.Eng.C,1998,5:289.

共引文献38

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部