摘要
压电与声光器件是组成电子和信息系统必不可少的功能器件。然而,多数压电与声光器件采用特殊材料和工艺制造,难以与硅基的集成电路进行集成,进而影响到系统的性能、体积和成本。近年来三维集成技术的发展为不同材料、不同工艺的压电与声光器件与硅基电路芯片的异质异构集成开辟了新途径。该文介绍了三维集成的概念、分类和实现方法,并重点介绍了光电、压电材料与器件和硅基电路的异质异构集成方案和研究进展,特别是光子器件以及压电声学器件与电子芯片的集成。
Piezoelectric and acousto-optic devices are essential functional components of modern electronic and information systems.However,most piezoelectric and acousto-optic devices are manufactured using special materials and processes that are highly different from silicon integrated chips,making it difficult to integrate these devices with silicon integrated circuit chips,which in turn affects the performance,volume,and cost of the systems.In recent years,the advances of three-dimensional(3D)integration technology have paved the way for heterogeneous integration of piezoelectric and acousto-optic devices with different materials and processes,as well as silicon chips.This paper introduces the concept,classification,and implementation methods of 3D integration technologies,and focuses on the heterogeneous integration schemes and research progress of optoelectronic and piezoelectric materials and device with silicon integrated circuits,especially the integration of photonic and piezoelectric acoustic devices with silicon integrated chips.
作者
王梓霖
王喆垚
WANG Zilin;WANG Zheyao(School of Integrated Circuits,Tsinghua University,Beijing 100084,China)
出处
《压电与声光》
北大核心
2025年第1期1-19,共19页
Piezoelectrics & Acoustooptics
关键词
三维集成
压电器件
声光器件
硅芯片
3D integration
piezoelectric device
acousto-optic device
silicon chip
