摘要
应用于电子封装的聚合物基复合材料应具有优异的介电性能和导热性。本文通过水热法制备薄水铝石(Boehmite,AlOOH),采用3-氨丙基三乙氧基硅烷(APTES)和γ-缩水甘油醚氧丙基三甲氧基硅烷(KH560)分别对凹凸棒土(ATP)和AlOOH进行表面改性,将改性的ATP和AlOOH复合后填充进环氧树脂(EP)基体中,制备得到mATP-mAlOOH/EP复合材料。结果表明,当mATP-mAlOOH复合粉体的填料比为3∶3时,mATP-mAlOOH/EP复合材料在10~2Hz频率下介电常数低至3.89,且保持较低的介电损耗(0.0236),介电强度达到16.88kV·mm^(-1),导热系数为0.223W·(m·K)^(-1),比纯EP提高了25.28%。
Polymer matrix composites applied in electronic packaging should have excellent dielectric properties and thermal conductivity.In this paper,Boehmite(AlOOH)was prepared by hydrothermal method,3-aminopropyltriethoxysilane(APTES)andγ-(2,3-epoxypropoxy)propytrimethoxysilane(KH560)were used for surface modification of ATP and AlOOH,respectively,and mATP-mAlOOH/EP composites were prepared by compositing the modified ATP and AlOOH and filling them into epoxy resin matrix.The results showed that when the filler ratio of mATP-mAlOOH composite powder was 3:3,the dielectric constant of mATP-mAlOOH/EP composite was as low as 3.89 at 102Hz and kept low dielectric loss(0.0236),the dielectric strength reached 16.88kV·mm^(-1),and the thermal conductivity was 0.223W·(m·K)^(-1),which was improved compared with pure EP by 25.28%.
作者
陈泽豪
马浩
丁海涵
吕兆伦
周宏
CHEN Ze-hao;MA Hao;DING Hai-han;LV Zhao-lun;ZHOU Hong(School of Materials Science and Chemical Engineering,Ministry of Education,Harbin University of Science and Technology,Harbin 150080,China;Key Laboratory of Engineering Dielectrics and Its Application,Ministry of Education,Harbin University of Science and Technology,Harbin 150080,China)
出处
《化学工程师》
2025年第3期96-99,28,共5页
Chemical Engineer
基金
哈尔滨理工大学大学生创新项目(S202210214158)。
