摘要
纳米铜粉在电子封装领域可作为浆料的填充材料实现低温烧结,替代价格较高的银,具有广阔的应用前景。纳米铜粉的尺寸、形貌、纯度等与制备方法密切相关,有必要深入了解不同制备方法,实现粒径精准控制。综述了3种主流的纳米铜粉制备方法,重点对成本较低的液相还原法进行了介绍。介绍了纳米铜粉在低温烧结铜浆中的应用,分析了浆料成分、烧结参数等因素对铜浆烧结性能的影响,指明了纳米铜粉的技术瓶颈及发展趋势,纳米铜粉的粒径、形貌可控及抗氧化措施将成为未来研究热点。
Nanometer copper powder can be used as the filler material of the paste to enable low-temperature sintering in the field of electronic packaging,replacing the higher-priced silver,which has a broad application prospect.The size,morphology and purity of nanometer copper powder are closely related to the preparation methods,and it is necessary to have an in-depth understanding of the different preparation methods to achieve precise control of particle size.Three mainstream preparation methods of nanometer copper powder are reviewed,and the low-cost liquid-phase reduction method is introduced in detail.The application of nanometer copper powder in low-temperature sintered copper paste is introduced,the influence of paste composition,sintering parameters and other factors on the sintering properties of copper paste is analyzed.The technical bottleneck and development trend of nanometer copper powder are pointed out,and the particle size,controllable morphology and antioxidant measures of nanometer copper powder will become research hotspots.
作者
王一帆
汪根深
孙德旺
陆冰沪
章玮
李明钢
WANG Yifan;WANG Genshen;SUN Dewang;LU Binghu;ZHANG Wei;LI Minggang(School of Metallurgy and Environment,Central South University,Changsha 410083,China;Anhui Institute of New Nonferrous Metal Materials,Hefei 230601,China)
出处
《电子与封装》
2025年第3期100-107,共8页
Electronics & Packaging
关键词
纳米铜粉
液相还原法
铜烧结
电子封装
nanometer copper powder
liquid phase reduction method
copper sintering
electronic packaging
