摘要
以第三代半导体为核心的功率电子器件向高功率密度、高结温方向的发展对封装互连材料、工艺及服役条件下的可靠性都提出了严苛的挑战。纳米铜(Cu)焊膏具有低成本、抗电迁移性、优异的导电导热性能和“低温烧结、高温服役”特性,是1种极具工业化潜力的功率器件封装候选材料,受到广大研究者的密切关注。然而,相比于纳米银(Ag)焊膏,纳米铜焊膏的稳定性(易氧化)和低温烧结性能仍有较大的差距。根据试验结果,从烧结机理、烧结工艺、性能表现以及纳米铜烧结接头的服役可靠性等方面,系统阐述了纳米铜焊膏烧结技术的最新进展。此外,针对目前纳米铜烧结技术的不足,对后续的发展方向和研究前景进行了展望。
Third-generation semiconductor as the core of the power electronics devices towards high power density and high junction temperature direction presents strict challenges to the package interconnect materials,processes and reliability under service conditions.Nano copper(Cu)solder paste has emerged as a kind of industrialization potential power device packaging candidate material owing to its low cost,electromigration resistance,and excellent electrical and thermal conductivity,along with the characteristic of"low-temperature sintering and high-temperature service",which has been closely concerned by the researchers.However,there is still a large gap between the stability(easy oxidation)and low-temperature sintering performance of nano-copper solder pastes compared to nano-silver(Ag)solder pastes.Based on the experimental results,the latest progress of nano-copper solder paste sintering technology is systematically described in terms of sintering mechanisms,sintering processes,performance behavior and service reliability of nano-copper sintered joints.Furthermore,in view of the shortcomings of the current nano-copper sintering technology,the subsequent development direction and research prospects are prospected.
作者
王秀琦
李一凡
罗子康
陆大世
计红军
WANG Xiuqi;LI Yifan;LUO Zikang;LU Dashi;JI Hongjun(School of Integrated Circuits,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China;State Key Laboratory of Precision Welding&Joining of Materials and Structures,Shenzhen Branch,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China;School of Materials Science and Engineering,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China)
出处
《电子与封装》
2025年第3期3-15,共13页
Electronics & Packaging
基金
国家自然科学基金(NSFC 51775140、NSFC 52232004)
广东省重点领域研发计划(2019B010935001)
中央高校基本科研业务费(HIT.DZJJ.2023112)。
关键词
电子封装
第三代半导体
烧结
纳米铜
纳米铜焊膏
抗剪强度
可靠性
electronic packaging
third-generation semiconductor
sintering
nano copper
nano copper solder paste
shear strength
reliability
