摘要
为探究微整形磨粒电镀金刚石线锯在加工单晶硅时对切片表面质量的影响,研究走丝速度与进给速度对切片表面质量的影响规律。采用往复式金刚石线切割机对单晶硅进行了锯切试验,切片完成后,使用表面粗糙度仪对切片表面进行粗糙度测量,利用扫描电镜观测切片表面的形貌及线锯的磨损情况。试验结果表明:采用微整形磨粒电镀金刚石线锯加工获得的切片表面沿走丝方向的粗糙度低于沿进给方向的粗糙度。走丝速度与进给速度的变化对硅片沿进给方向的表面粗糙度影响显著,而沿走丝方向的粗糙度变化较小。当走丝速度从6 m/s提高至8 m/s和13 m/s时,沿进给方向的表面粗糙度分别下降30.4%和30.5%;当进给速度从2μm/s减小至1μm/s和0.6μm/s时,沿进给方向的表面粗糙度分别下降18.4%和45.5%。随着走丝速度的增加与进给速度的减小,硅片表面的脆性破碎凹坑减少,而塑性剪切沟槽增多,表面形貌得到改善。微整形磨粒电镀金刚石线锯加工过程中,材料去除方式为塑性去除和脆性去除两种模式共存。线锯的磨损主要表现为磨粒磨损,磨粒变平变钝,少量磨粒出现脱落和破碎现象。
To investigate the effect of micro shaped abrasive grain electroplated diamond wire saw on the surface quality of sliced silicon during processing,and to study the influence of wire speed and feed rate on the surface quality of sliced silicon,sawing experiments are conducted on single crystal silicon using a reciprocating diamond wire cutting machine.After the slicing is completed,the roughness of the sliced surface is firstly measured using a surface roughness meter,and then the morphology of the sliced surface and the wear state of the wire saw are observed using a scanning electron microscope.The test results show that the roughness of the surface of the slices obtained by wire saw machining with micro-shaping grit plating is lower along the wire travelling direction than that along the feeding direction.Changes in wire travelling speed and feed speed have a significant effect on the surface roughness of silicon wafers along the feed direction,while changes in roughness along the wire travelling direction are small.The surface roughness along the feed direction decrease by 30.4%and 30.5%when the wire travelling speed is increased from 6 m/s to 8 m/s and 13 m/s,respectively;and the surface roughness along the feed direction decreases by 18.4%and 45.5%when the feed speed is reduced from 2μm/s to 1μm/s and 0.6μm/s,respectively.As the wire travelling speed increases and the feed rate decreases,the brittle cratering craters on the wafer surface decrease,while the plastic shear grooves increase,and the surface morphology is improved.The material removal during micro-shaping grit plated diamond wire sawing is a coexistence of two modes of plastic and brittle removal.Wear on wire saws is mainly characterised by abrasive wear,flattening and dulling of the abrasive grains,with a small amount of abrasive grains falling off and breaking up.
作者
赵桂丽
葛梦然
刘尧
姜鹏程
刘志东
吕志杰
Zhao Guili;Ge Mengran;Liu Yao;Jiang Pengcheng;Liu Zhidong;LüZhijie(School of Mechanical and Electrical Engineering,Shandong Jianzhu University,Jinan 250101,China)
出处
《机电工程技术》
2025年第4期90-94,176,共6页
Mechanical & Electrical Engineering Technology
基金
国家自然科学基金(52005301)。
关键词
微整形磨粒
电镀金刚石线锯
单晶硅
表面质量
micro-shaping abrasives
electroplated diamond wire saws
single-crystal silicon
surface quality
