摘要
在微波组件模块中,为防止裸芯片加工后出现的磕碰、氧化及加速老化等问题,需要对微波组件模块进行封盖处理,以保证其有良好的气密性和使用性能。采用激光封焊技术焊接6061/4047铝合金,采用电火花线切割机切取焊缝试样。采用金相显微镜分析焊缝组织形貌,并使用显微硬度计测试焊缝硬度。采用拉力试验机进行破坏性拉力试验,并使用金相显微镜观察断口形貌。结果表明,焊缝与6061/4047铝合金界面形成了良好的冶金层,焊缝硬度低于6061/4047铝合金,焊缝中心位置的硬度最高,拉伸断口位于6061铝合金侧,断口为典型的塑性断裂形貌。
In the microwave component module,in order to prevent the collision,oxidation and accelerated aging of the bare chip after processing,it is necessary to cover the microwave component module to ensure good airtightness and performance.The 6061/4047 aluminum alloy is welded by laser sealing welding technology,and the welding seam samples are cut by wire electrical discharge machine.The microstructure of welding seam is analyzed by metallographic microscope,and the hardness of welding seam is measured by micro-hardness tester.The destructive tensile test is carried out by tensile testing machine,and the fracture morphology is observed by metallographic microscope.The results show that a good metallurgical layer is formed at the interface between the welding seam and 6061/4047 aluminum alloy,and the hardness of welding seam is lower than that of 6061/4047 aluminum alloy.The hardness is highest at the center of the welding seam,the tensile fracture is located on the side of 6061 aluminum alloy,and the fracture is a typical plastic fracture morphology.
作者
徐强
杨丽菲
舒钞
肖富强
XU Qiang;YANG Lifei;SHU Chao;XIAO Fuqiang(Chengdu Hongke Electronic Technology Co.,Ltd.,Chengdu 610000,China)
出处
《电子与封装》
2025年第2期13-16,共4页
Electronics & Packaging
关键词
铝合金
激光封焊
组件模块
显微组织
力学性能
aluminum alloy
laser sealing welding
component module
microstructure
mechanical performance
