摘要
To improve the application and service of C_(f)/SiC composites as advanced hightemperature structural materials,it is critical to achieve their high-efficiency and low-damage machining.In this study,the laser-ablating assisted grinding(LAAG)method was presented,and the connection of damage behavior and removal mechanism with laser and grinding processes was revealed.The results demonstrated that the surface of C_(f)/SiC composites after laser ablation was covered with a substantial number of loose oxides primarily composed of SiO2.Laser ablating process,grinding parameter and abrasive belt selection have a significant impact on the machining results.By fabricating an ablative layer with small laser scanning spacing,and selecting small abrasive grains and feed rate during grinding,the machinability was improved and a relatively lowerdamage grinding surface could be obtained.Under the optimal combination of process parameters,the grinding force and temperature of LAAG could be reduced by up to 85%and 35%,respectively.In this case,the subsurface damage of C_(f)/SiC composites occurred only in the form of microcracks rather large-scale fracture,and the formation of interface debonding and matrix cracking was significantly reduced.Furthermore,the grinding chips were mostly shown as micron-sized powders,indicating that the removal mechanism of C_(f)/SiC composites was primarily the microfractured and attrition wear of laser-ablated layer.
基金
co-supported by the National Natural Science Foundation of China(No.52205444)
the Natural Science Foundation of Chongqing(No.CSTB2022NSCQMSX1128)。
