摘要
本文运用热力学方法对环板行波管互作用区进行了详细的热分析,首先由热传导方程导出了求解热传导率随温度改变的部件温升的方程.为求解该方程,详细分析了各部件的几何因子,在此基础上,近似考虑界面热阻,给定单位轴向长度的耗散功率和几何参量,对各部件温升和环上的最高点温度进行了详细的数值模拟,分析了热的和几何的参量对环板行波管热状态的影响.本文的工作有益于环板行波管的设计,并可以推广到环板慢波系统的变态结构.
The thermal behavior of the ring-plane TWT in the interaction area was analyzed by means of the thermodynamic method. The geometric factor, which describes the thermal resistance of the structure for constant thermal conductivity, was defined by solving the heat conduction equation. Starting from the definition of the geometric factor and taking the interface heat resistance into account approximately, the actual temperature rising of all assemblies of the TWT was calculated under the case of that the thermal conductivity varies with the temperature. Making use of the numerical results, the maximum temperature was also given in this paper. The influences of the thermal and geometrical parameters on the heal behavior were discussed. The results presented here are beneficial to the design of the ring-plane TWT.
出处
《电子学报》
EI
CAS
CSCD
北大核心
2002年第12期1848-1852,共5页
Acta Electronica Sinica
基金
大功率微波电真空器件技术国防科技重点实验室基金(No.2000JS1O.1.1.DZ02)
