摘要
Stereolithography(SLA)combined with a two-step post-processing method“oxidation−reduction”was developed to fabricate pure copper with high complexity.The copper slurries for SLA were prepared,and particularly the influence of volume fraction of copper on the properties of copper slurries was investigated.In the two-step post-treatment process,organics were removed by oxidation and copper powder was oxidized simultaneously,and then the oxidized copper was reduced into highly reactive copper particles,improving the sintering activity of the copper green body and enhancing the relative density of the sintered part.The results show that curing depth of the copper slurries decreased with the increase of volume fraction of copper.The viscosity of the pure copper slurry rises exponentially as the volume fraction of copper exceeded 50%.The highest volume fraction of pure copper slurry for SLA is 55%.The specimens exhibited an increase in hardness and electrical conductivity with the increase of volume fraction of copper.Specifically,the maximum values of hardness and conductivity of samples with 55 vol.%copper were HV 52.7 and 57.1%(IACS),respectively.
采用立体光刻(SLA)并结合“氧化−还原”两步后处理法制造复杂形状的纯铜部件。制备了SLA用铜浆,并重点考察了铜体积分数对铜浆性能的影响。在两步后处理过程中,通过氧化将生坯内的有机物排除并同时氧化铜粉,再将氧化铜还原成高活性的铜颗粒,进而增加铜生坯的烧结活性,并提高烧结体的相对密度。结果表明:铜浆的固化深度随铜体积分数的增加而减小。当铜的体积分数超过50%时,纯铜浆的黏度呈指数上升。适用于SLA纯铜浆料的最高体积分数为55%。随着铜体积分数的增加,样品的硬度和电导率增加。当铜体积分数为55%时,样品的硬度和电导率均达到最大值,分别为HV 52.7和57.1%(IACS)。
基金
supported by the Major Science and Technology Projects in Fujian Province,China(No.2023HZ021005)
the State Key Laboratory of Powder Metallurgy,Central South University,China,and Fujian Key Laboratory of Rare-earth Functional Materials,China.
