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Hybrid-integrated 200 Gb/s REC-DML array transmitter based on photonic wire bonding technology 被引量:1

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摘要 An 8-channel hybrid-integrated chip for 200 Gb/s(8×25 Gb/s)signal transmission has been demonstrated.The channels are all within the O-band,and with a spacing of 800 GHz.The core of this chip is a monolithic integrated multi-wavelength laser array of 8 directly-modulated distributed feedback(DFB)lasers.By using the reconstruction equivalent chirp technique,multi-wavelength integration and asymmetric phase shift structures are achieved in the laser array.The output laser beams of the array are combined by a planar light-wave circuit,which is hybrid-integrated with the laser array by photonic wire bonding.Experiment results of this transmitter chip show good single-mode working of each unit laser,with a sidemode suppression ratio above 50 dB,and the modulation bandwidth is above 20 GHz.Clear eye diagrams are obtained in the lasers for 25 Gb/s non-return-to-zero modulation,which implies a total 200 Gb/s transmission rate for the whole chip.
作者 Yuxin Ma Jie Zhao Tongtong Yang Yipeng Mei Zhenxing Sun Jun Lu Shaobo Li Xiang Ma Xiangfei Chen 马雨心;赵杰;杨彤彤;梅一芃;孙振兴;陆骏;李少波;马向;陈向飞(Key Laboratory of Intelligent Optical Sensing and Manipulation of the Ministry of Education&National Laboratory of Solid State Microstructures&College of Engineering and Applied Sciences&Institute of Optical Communication Engineering&Nanjing University-Tongding Joint Lab for Large-Scale Photonic Integrated Circuits,Nanjing University,Nanjing 210023,China;Optical Communication Research and Development Center,54th Research Institute of China Electronics Technology Group Corporation,Shijiazhuang 050081,China)
出处 《Chinese Optics Letters》 SCIE EI CAS CSCD 2024年第8期64-69,共6页 中国光学快报(英文版)
基金 supported by the National Key Research and Development Program of China(Nos.2018YFA0704402,2018YFB2201801,2018YFE0201200,and 2020YFB2205800) National Natural Science Foundation of China(Nos.61975075,61975076,and 62004094) Natural Science Foundation of Jiangsu Province(No.BK20200334) Jiangsu Science and Technology Project(No.BE2017003-2)。
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