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Grain growth behavior and properties of high-entropy pseudobrookite(Mg,Co,Ni,Zn)Ti_(2)O_(5) ceramics

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摘要 It is well known that the grain size of high-entropy ceramics is quite small owing to the sluggish diffusion effect. However, abnormal grain growth often occurs in high-entropy pseudobrookite ceramics, ultimately resulting in the formation of many abnormally grown grains with a grain size as large as 50 μm. To study this phenomenon, the grain growth behavior of high-entropy pseudobrookite ceramics was systematically investigated in this paper. The results demonstrate that the starting material powders first react with each other to form a high-entropy intermediate phase and calcined TiO_(2) powders (TiO_(2)-1100 ℃), and then as the sintering temperature increases, the formed high-entropy intermediate phase further reacts with TiO_(2)-1100 ℃ to form high-entropy pseudobrookite ceramics. Thus, in this system, in addition to the sluggish diffusion effect, the grain sizes of the high-entropy intermediate phase and TiO_(2)-1100 ℃ also affect the morphology of high-entropy pseudobrookite. Compared to nanosized TiO_(2), micron-sized TiO_(2) has a lower sintering activity. Therefore, the high-entropy intermediate phases (Mg,Co,Ni,Zn)TiO_(3) and TiO_(2)-1100 ℃ prepared with micron-sized starting materials exhibit lower grain sizes, finally resulting in the formation of high-entropy (Mg,Co,Ni,Zn)Ti_(2)O_(5) with small grain sizes. Moreover, nano-indentation and thermal conductivity tests were carried out on high-entropy (Mg,Co,Ni,Zn)Ti_(2)O_(5) with different morphologies. The results show that the hardness of high-entropy (Mg,Co,Ni,Zn)Ti_(2)O_(5) increases from 6.05 to 9.95 GPa as the grain size increases, whereas the thermal conductivity decreases from 2.091±0.006 to 1.583±0.006 W·m^(−1)·K^(−1). All these results indicate that high-entropy (Mg,Co,Ni,Zn)Ti_(2)O_(5) with a small grain size is a potential material for thermal protection.
出处 《Journal of Advanced Ceramics》 SCIE EI CAS CSCD 2024年第6期757-768,共12页 先进陶瓷(英文)
基金 financial support from the National Key R&D Program of China(No.2023YFB3711200) the National Natural Science Foundation of China(No.52172072).
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