摘要
封帽是TO(Transistor Outline,TO)型光器件制造中关键工序之一,本文介绍了TO封帽机主要采用的三种视觉对位方法,并分别论述了三种方法的优缺点,通过分析比较,认为文中所述的第二种方式和第三种方式结合更适用于封帽工艺。
Capping is one of the key processes in the manufacturing of TO(Transformer Outline,TO)optical devices.This article introduces the three main visual alignment methods used in TO capping machines,and discusses the advantages and disadvantages of each method.Through analysis and comparison,it is believed that the combination of the second and third methods described in the article is more suitable for capping processes.
作者
王瑞鹏
孙文涛
郝鹏飞
Wang Ruipeng;Sun Wentao;Hao Pengfei(The 2th Insitute of CETC,Taiyuan Shanxi 030024,China)
出处
《山西电子技术》
2024年第3期117-119,共3页
Shanxi Electronic Technology
关键词
TO器件
封帽
视觉对位
TO device
capping
vision alignment
