摘要
分析了封装基板芯层机械钻孔加工难点、微钻失效机理和常见钻孔品质问题。设计了4种槽型的微钻,并分别与3种涂层进行集成设计,考查对比了各种微钻在加工倒装芯片球栅格阵列(FC-BGA)封装基板芯层时的排屑能力、钻削温度、刀具磨损、孔位精度和孔壁粗糙度,优选了最佳的槽型和涂层集成设计。结果表明:槽型B、C与SHC涂层集成设计微钻,以及槽型C、D与NC涂层集成设计微钻,加工7 000孔能满足品质要求;槽型D与NC涂层集成设计微钻,加工10 000孔能满足品质要求,是封装基板芯层钻孔的有效解决方案。
The difficulties in mechanical drilling of the core layer of packaging substrate,the failure mechanism of micro drilling,and common drilling quality issues were analyzed.Four types of micro drills with different flute shapes were designed and integrated with three coatings.The chip removal capability,drilling temperature,tool wear,hole position accuracy,and hole wall roughness when using various micro drlls in processing the core layer of FC-BGA packaging substrate were investigated and compared.The optimal flute shape and coating integrated design was selected.The results show that the integrated design of flute B,C and SHC coating,as well as the integrated design of flute C,D and NC coatings,can meet the quality requirements after processing 7000 holes;the integrated design of flute D and NC coating,which can process 10000 holes to meet quality requirements,is an effective solution to the drilling of the core layer of packaging substrate.
作者
屈建国
孙玉双
张辉
金哲峰
陈成
胡健
付连宇
QU Jianguo;SUN Yushuang;ZHANG Hui;JIN Zhefeng;CHEN Cheng;HU Jian;FU Lianyu(Shenzhen Jinzhou Precision Technology Co.,Ltd.,Shenzhen 518100,Guangdong,China)
出处
《印制电路信息》
2023年第12期25-34,共10页
Printed Circuit Information
基金
国家重点研发计划课题(2022YFB3806703)
深圳市技术攻关重点项目(JSGG20200914113603008)。
关键词
封装基板
钻孔品质
微钻槽型
涂层
packaging substrate
drilling quality
micro-drill lute shape
coating
