摘要
研究真空灭弧室的温升特性对于其结构参数的优化和保障其自身的流通能力具有重要意义。用SolidWorks软件建立真空灭弧室的导电回路3D模型并对其结构进行简化,采用ANSYS Workbench软件对真空灭弧室的仿真模型进行涡流场-温度场耦合分析,对额定电流状态下导电回路的温升进行仿真计算。结果表明:增大触头片接触点直径、增大杯壁厚度、减小杯壁螺旋开槽长度和增大导电杆的半径等尺寸参数对真空灭弧室的温升均有所改善。对优化后的模型按照触头材料为CuCr50和CuCr10分别对其进行仿真,结果发现,CuCr10的触头片材料温升远低于CuCr50时的温升,且CuCr10能承受更大的电流,因此可以考虑通过改变触头材料来实现优化真空灭弧室的温升特性。
For optimizing its structure parameters and guaranteeing its own breaking performance,SolidWorks software was used to establish a 3D model of the conductive circuit of the vacuum interrupters,and its structure was simplified in this study.ANSYS Workbench was used for thermal analysis of the simulation model of the vacuum interrupters,and the coupling method of eddy current field and temperature field was used to simulate the temperature rise of the conductive circuit under the rated current state.The results shown that the temperature rise of the vacuum interrupters can be improved by increasing the contact point diameter of the contact plate,the thickness of the cup wall and the radius of the conductive rod and by decreasing helical grooving length of the cup wall.The optimized model was simulated according to the contact material CuGr50 and CuCrlO respectively.The results shown that compared with the contact material CuCr50,the temperature rise of the contact material CuCrlO is much lower than that of the contact material CuGr50,and it can withstand higher current.The temperature rise characteristics of the vacuum interrupters can be optimized by changing the contact material.
作者
董华军
赵一鉴
时佳
何晨阳
DONG Huajun;ZHAO Yijian;SHI Jia;HE Chenyang(School of Mechanical Engineering,Dalian Jiaotong University,Dalian 116028,China;Department of Automatic Control Engineering,Liaoning Mechatronics College,Dandong 118009,China)
出处
《大连交通大学学报》
CAS
2023年第2期61-64,共4页
Journal of Dalian Jiaotong University
基金
辽宁省“百千万人才工程”培养经费资助项目。
关键词
真空灭弧室
涡流场
温度场
结构优化
vacuum interrupters
eddy current field
temperature field
structure optimization
