摘要
阐述了近年来反应型聚氨酯(PUR)热熔胶的研究进展,系统讨论了不同种类PUR热熔胶的固化机理、材料结构设计以及性能调控方法等。此外,阐述了PUR热熔胶在电子产品组装方面的应用。最后对PUR热熔胶在电子组装方面的应用和挑战提出了展望。
The research progress of reactive polyurethane(PUR)hot melt adhesive in recent years was reviewed.The curing mechanism,material design and performance optimization of different kinds of PUR hot melt adhesive were systematically discussed.In addition,the application of PUR hot melt adhesive in electronic assembly was described.Finally,the application and challenge of PUR hot melt adhesive in electronic assembly were prospected.
作者
徐玉文
颜明发
Xu Yuwen;Yan Mingfa(Dongguan U-Bond Material Technology Co.,Ltd.,Dongguan 523837,Guangdong,China)
出处
《中国胶粘剂》
CAS
2022年第10期65-69,共5页
China Adhesives
关键词
反应型聚氨酯热熔胶
电子组装
硅烷改性
光-湿双固化
reactive polyurethane hot melt adhesive
electronic assembly
silane-modification
light-moisture dual-curing
