摘要
This research investigated the combined effects of addition of Bi and Sb elements on the microstructure,thermal properties,ultimate tensile strength,ductility,and hardness of Sn−0.7Ag−0.5Cu(SAC0705)solder alloys.The results indicated that the addition of Bi and Sb significantly reduced the undercooling of solders,refined theβ-Sn phase and extended the eutectic areas of the solders.Moreover,the formation of SbSn and Bi phases in the solder matrix affected the mechanical properties of the solder.With the addition of 3 wt.%Bi and 3 wt.%Sb,the ultimate tensile strength and hardness of the SAC0705 base alloy increased from 31.26 MPa and 15.07 HV to 63.15 MPa and 23.68 HV,respectively.Ductility decreased due to grain boundary strengthening,solid solution strengthening,and precipitation strengthening effects,and the change in the fracture mechanism of the solder alloys.
研究添加Bi和Sb元素对Sn−0.7Ag−0.5CU(SAC0705)焊料合金显微组织、热性能、极限抗拉强度、延展性和硬度的共同影响。结果表明,Bi和Sb的加入显著降低焊料的过冷度,细化焊料的β-Sn相以及扩大焊料的共晶区域。此外,焊料基体中SbSn相和Bi相的形成也影响焊料的力学性能。添加3%(质量分数)的Bi和3%(质量分数)的Sb后,SAC0705合金的极限抗拉强度和硬度从31.26 MPa和15.07 HV分别提高到63.15 MPa和23.68 HV。焊料合金的晶界强化、固溶强化和析出强化以及断裂机制的改变导致其延展性降低。
基金
supported by the Division of Physical Science,Faculty of Science,Prince of Songkla University (PSU),Thailand
