摘要
封接性聚酰亚胺是一类可以与自身或其他介质黏结,以形成大规模形态或复合结构的材料。聚酰亚胺通过封接发挥结构支撑、防护和功能特性赋予等作用。综述了聚酰亚胺封接性的实现方法、本征热封性聚酰亚胺,介绍了封接性聚酰亚胺在空间和电子等领域的应用,并对封接性聚酰亚胺未来的重点发展方向做了展望。聚酰亚胺封接性的实现方法包括表面辐照改性、表面化学改性、表面助黏剂涂覆等表面处理方法,以及利用聚酰亚胺前驱体。本征热封性聚酰亚胺是一种可直接通过热压过程实现封接的材料,综述了其分子结构设计思路及主要商业化产品。
Sealable polyimide was a kind of material capable of adhering to itself or another material to form a large-scale or composite configuration.By sealing,polyimide could play a role of being structural,protectional and functional.Sealable polyimides were reviewed,including methods to achieve sealing of polyimides,intrinsically heat-sealable polyimides and applications of sealable polyimides in space and electronics.In addition,the outlook for the development of sealable polyimides was made.The methods to achieve sealing of polyimides including surface treatments,such as,radiation,chemical modification and surface coating,and employing its precursor were provided.Intrinsically heat-sealable polyimide was a kind of material that could be directly sealed by heat pressing.Molecular structure design strategy for intrinsically heat-sealable polyimide was introduced as well as its main commercial products.
作者
倪洪江
李军
张代军
刘金刚
杨士勇
陈祥宝
NI Hongjiang;LI Jun;ZHANG Daijun;LIU Jingang;YANG Shiyong;CHEN Xiangbao(Center of Soft Material Research,Institute of Aeronautical Materials,AECC,Beijing 100095,China;National Key Laboratory of Advanced Composites,Beijing 100095,China;School of Materials Science and Technology,China University of Geosciences,Beijing 100083,China;Key Laboratory of Science and Technology on High-tech Polymer Materials,Chinese Academy of Sciences,Beijing 100190,China)
出处
《塑料工业》
CAS
CSCD
北大核心
2022年第3期1-9,共9页
China Plastics Industry
基金
中国科协青年人才托举工程(YESS20200158)。
关键词
聚酰亚胺
封接性
大规模结构
复合结构
空间应用
电子应用
Polyimides
Sealability
Large-scale Configuration
Composite Configuration
Space Application
Electronic Application
