摘要
为了探索纳米银浆在大功率器件组装中的应用可靠性,亟待获得纳米银浆的烧结特性和热力学性能。本文对不同烧结温度、烧结时间、升温速率、烧结方式的纳米银浆样件烧结强度,结合烧结形貌进行了系统研究,并与航天电子产品中常规的互连材料Au80Sn20焊料、Sn90.5Ag3Cu0.5焊料以及H20E导电胶的散热性进行了对比分析。研究结果表明:采用可控升温速率空气氛围的烧结方式,在200℃下保温90 min,银浆样件的剪切强度最高可达40 MPa。纳米银浆导热性能与Au80Sn20相当,明显高于H20E和SAC305。在经历严酷的热应力和机械应力试验后,其剪切强度保持稳定,因此纳米银浆作为高导热连接材料在宇航大功率器件组装中具有良好的应用前景。
In order to explore the application reliability of nano-silver pastes in high-power electronic devices,it is necessary to obtain the sintering characteristics and thermo-mechanical properties of sintered nano-silver.By varying sintering temperature,sintering time,heating rate and sintering method,the mechanical strength of sintered nano-silver is investigated with systematical observations of material morphology. Furthermore, the thermal conductivity of sintered nano-silver is compared with the conventional die-attach materials in aerospace electronic products such as Au80 Sn20 solder,Sn96.5 Ag3.0 Cu0.5 solder,and H20 E adhesive. The results indicate that the shear strength up to 40 MPa can be achieved from those nano-silver samples prepared at the temperature of 200 ℃for 90 min in air atmosphere with a controllable heating rate. It is also found that the sintered nano-silver has a similar thermal conductivity with the Au80 Sn20 solder,which is significantly greater than H20 E adhesive and Sn96.5 Ag3.0 Cu0.5 solder. After harsh thermal and mechanical experiments,the shear strength of sintered nanosilver remains stable,which confirms that nano-silver pastes with high thermal conductivities can serve as bonding materials for potential aerospace applications in the assembly of high-power devices.
作者
夏维娟
冯晓晶
胡媛
周澄
龙旭
XIA Weijuan;FENG Xiaojing;HU Yuan;ZHOU Cheng;LONG Xu(Academy of Space Electronic Information Technology,Xi’an 710100;School of Mechanics,Civil Engineering and Architecture,Northwestern Polytechnical University,Xi’an 710072)
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2021年第6期71-76,共6页
Aerospace Materials & Technology
关键词
纳米银浆
烧结条件
剪切条件
导热性
可靠性
Nano-silver paste
Sintering condition
Shearing condition
Thermal conductivity
Reliability
