摘要
利用固结磨粒自旋转磨削加工方法,通过金刚石磨削和化学机械磨削实现了蓝宝石晶片的高效、高质量平坦化加工。采用不同磨粒粒径的金刚石砂轮实现了蓝宝石晶片较高的材料去除率或较好的表面质量。开发了高磨粒浓度Cr2O3砂轮,采用化学机械磨削对金刚石磨削后的蓝宝石晶片进行平坦化加工。实验结果表明,化学机械磨削能够去除金刚石磨削的表面和亚表面缺陷,最终获得表面粗糙度Ra<1 nm、无/微损伤的蓝宝石晶片。通过理论分析单颗金刚石磨粒的磨削力,发现磨粒粒径是影响材料去除率和表面质量的主要影响因素。通过XPS分析证明了Cr2O3和蓝宝石之间的固相反应过程。
A planarization method was presented for sapphire substrate with high quality and efficiency by applying fixed abrasive based diamond and chemo-mechanical grinding on self-rotation grinding platform.Diamond grinding wheel with different abrasive sizes was able to either obtain faster material removal rate or better surface quality.Then,high Cr2O3 abrasive concentrated wheel was developed,and chemo-mechanical grinding was applied for the planarization processes of sapphire substrate.Experimental result suggests that chemo-mechanical grinding is able to remove the surface and subsurface damages left by diamond grinding.The obtained sapphire substrate is with surface quality Ra less than 1 nm and no/little subsurface damages.Theoretical analysis to the grinding forces for single diamond particle reveals that particle size is the most influential factor on material removal rate and surface quality.The solid phase reaction between Cr2O3 and sapphire was demonstrated by XPS analysis.
作者
吴柯
陆新明
MEHMOOD Awais
周立波
袁巨龙
WU Ke;LU Xinming;MEHMOOD Awais;ZHOU Libo;YUAN Julong(Faculty of Mechanical Engineering and Mechanics,Ningbo University,Ningbo,Zhejiang,315000;School of Engineering,Ibaraki University,Hitachi,Japan,316-8511;Ultra-precision Machining Center,Zhejiang University of Technology,Hangzhou,310014)
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2021年第16期2002-2007,2015,共7页
China Mechanical Engineering
基金
国家自然科学基金(51905280)
宁波市自然科学基金(2019A610153)
宁波市科技创新2025重大专项(2018B10004)。
关键词
金刚石磨削
化学机械磨削
表面质量
材料去除率
diamond grinding
chemo-mechanical grinding
surface quality
material removal rate
