摘要
文章主要从回焊炉对电路板进行回流展开相关研究,因温度控制对产品最终质量至关重要,通过回焊炉焊接区域的温度变化,建立一维非稳态传热模型,便于对回焊炉实验进行控制和调整。
This paper focuses on the research on reflow of PCB by reflow furnace,the use of temperature control capability is critical to the final quality of the product,through the temperature change of the welding area of the reflow furnace,a one-dimensional unsteady heat transfer model is established,it is convenient to control and adjust the reflow furnace experiment.
作者
底绍轩
蒋科政
童劲
DI Shaoxuan;JIANG Kezheng;TONG Jin(Nanjing University of Information Science&Technology College of Atmospheric Sciences,Nanjing 210044,China)
关键词
非稳态传热模型
傅里叶传热定律
牛顿冷却定律
unsteady heat transfer model
Fourier heat transfer law
Newton cooling law
