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飞切加工KDP晶体的工艺研究 被引量:2

Study on processing KDP crystals by fly-cutting
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摘要 KDP晶体在惯性约束核聚变光学系统中具有十分重要的作用,针对如何制造出满足应用要求的KDP晶体元件仍然是一个难点的问题。进行了采用飞切加工技术对KDP晶体平面元件的加工工艺研究。介绍了飞切加工的技术原理,以及影响表面粗糙度的因素;通过相应的工艺实验,对KDP晶体加工检测过程中可能影响表面粗糙度的各个因素进行了研究。实验结果表明:金刚石刀具参数、加工参数、以及加工后表面清洁方式都会影响表面粗糙度,但是金刚石刀具参数对表面粗糙度的影响最大。采用前角为-45°、圆弧半径为5.0mm的金刚石刀具,以及最优的加工参数,可以获得表面粗糙度Sa优于1nm的超光滑表面。研究结果对飞切加工KDP晶体平面元件提供了有效的工艺方案,具有广泛的工程应用价值。 KDP crystal plays an important role in inertial confinement fusion(ICF) optical system. However, how to obtain KDP crystal elements with the application requirements is still a difficult problem. The processing technology of KDP crystal flat element is studied using fly-cutting technology. Firstly, the technical principle of fly-cutting and the influence factors of the surface roughness are explained. And then, the influence factors in processing are analyzed with single variable method through a mass of processing experiments. The experimental results show that the roughness of KDP surface is affected by the diamond tool parameters, the processing parameters and the cleaning method, but the diamond tool parameters have the greatest influence on the roughness. The ultra-smooth surface can be obtained by using diamond tool with rake angle of-45 °, tool radius of 5.0 mm and optimum processing parameters, and its corresponding Sa is less than 1 nm. The research results provide an effective technological scheme for the processing of KDP crystal flat elements by fly-cutting, and have extensive engineering application value.
作者 王守义 刘卫国 李世杰 惠迎雪 周顺 冯瑶 WANG Shouyi;LIU Weiguo;LI Shijie;XI Yingxue;ZHOU Shun;FENG Yao(Shaanxi Province Key Laboratory of Thin Films Technology and Optical Test,School o£Photoelectric Engineering,Xi'an Technological University,Xi'an 710021,China)
出处 《光学技术》 CAS CSCD 北大核心 2020年第6期757-762,共6页 Optical Technique
基金 西安市科技局科技创新引导项目(201805031YD9CG15(2)) 国家重点研发计划政府间科技创新合作重点专项项目(2018YFE0199200)。
关键词 单点金刚石切削 飞切 KDP晶体 表面粗糙度 single point diamond turning fly-cutting KDP crystal surface roughness
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