摘要
5G产品要实现传输信号的低损耗、低延迟,就应选用低D_k、低D_f、耐高温的高频板材。5G对于高频材料的需求量暴增,出于交付及成本压力,必须寻求多样化的材料供应渠道。主要介绍了5G功放PCB的材料选择方法。
To achieve low loss and low delay of transmission signals,5G products should use highfrequency boards with low D k,low D f and high temperature resistance.The demand for high-frequency materials in 5G is booming.Due to delivery and cost pressures,diversifi ed material supply channels must be found.The material selection method of 5G PA PCB is introduced.
作者
安维
曾福林
李敬科
任英杰
韩梦娜
AN Wei;ZENG Fulin;LI Jingke;REN Yingjie;HAN Mengna(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China;Zhejiang Wazam New Materials Corporation,Hangzhou 311121,China)
出处
《电子工艺技术》
2020年第6期333-337,361,共6页
Electronics Process Technology
