期刊文献+

用于串列加速器的微团簇离子源研究 被引量:1

Studies of microcluster ion source using in tandem accelerator
在线阅读 下载PDF
导出
摘要 设计、安装调试了一台微团簇离子源 ,其原理是气体放电与磁控溅射相结合产生溅射粒子 ,溅射产生的粒子经过一低真空区时 ,经历液氮冷凝和复杂的碰撞 ,形成微团簇离子 ,后经高压电场引出 ,测得离子混合束的总强度 .微团簇离子束经一分析磁场 ,得到 C+ n 和 Al+ n 的质谱 。 A microcluster ion source has been designed and set up. It adopts the principle of gas discharge and magnetic control sputtering. After the sputtering,the particles pass through a low vacuum area,encountering complicated collision and condensed in a low temperature environment caused by a liquid nitrogen vessel,and some of them become energetic clusters via extractive electric field,and the current of its total beam has gained. Mass spectrum analysis shows that the beam contains microclusters with the satisfying intensity. In this paper,the experimental results have also been discussed.
出处 《兰州大学学报(自然科学版)》 CAS CSCD 北大核心 2002年第5期28-32,共5页 Journal of Lanzhou University(Natural Sciences)
关键词 串列加速器 离子源 微团簇 气体放电 磁控溅射 液氮冷凝 产生原理 microcluster gas discharge magnetic control sputtering condensed by liquid nitrogen
  • 相关文献

参考文献1

共引文献3

同被引文献16

  • 1王广厚.团簇物理的新进展(Ⅰ)[J].物理学进展,1994,14(2):121-172. 被引量:103
  • 2韦伦存,赵子强,韩建伟,钟运成,于金祥,王浩.利用磁控溅射与液氮冷凝相结合产生金属及其化合物团簇[J].核技术,1997,20(2):83-86. 被引量:3
  • 3TEMBRELLO T A. Cluster-Solid Interaction[J]. Nucl Instr and Meth, 1995,B99:225~228.
  • 4WALT A, DE HEER. The physics of simple metal clusters: experimental aspects and simple models [J]. Rev Mod Phys, 1993, 65(3):611~622.
  • 5TAKAGI T. Ionized cluster beam teehnigue[J]. Vacuum,1986,36:27~31.
  • 6TAKAGI T. Ionized cluster beam reposition and epitaxy[C]. NJ: Noyes Publications, Park Ridge, 1998.
  • 7YAMADA I, USUI H, TAKGI T. The formation and kinetics of ionized cluster beams[J]. Z Phys, 1986, D3:137~140.
  • 8PRUETT J G, WINDISCHMANN H, NICHOLAS M L, et al. Cluster size and temperature measurement in a pure vapor source expansion[J]. J Appl Phys, 1988, 64: 2 271~2 278.
  • 9TURNER D,SHANKS H. Experimental and computational analysis of ionized cluster beam deposition[J]. J Appl Phys, 1991,70:5 385~5 400.
  • 10HABERLAND H, MALL M, MOSELER M, et al. Filling of micro-sized contact holes with copper by energetic cluster impact[J]. Vac Sci Tec, 1994, A12(5):2 925~2 927.

引证文献1

二级引证文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部