摘要
随着柔性电子技术的深入发展和材料低成本化的发展趋势,纳米铜浆作为替代纳米银浆的最佳选择得到了广泛关注。介绍了纳米铜粉和纳米铜浆的研究现状和制备技术,阐述了一种低温、瞬时、非接触、防氧化的光子烧结技术在柔性电子中的应用,为柔性电子技术的大规模应用提供了参考。
With the development of flexible electronic technology and the development trend of lowcost materials,nano copper paste as the best alternative to nano silver paste has been widely concerned.The research status and preparation technology of copper nanoparticles and nano copper paste are briefl y introduced,and the application of a low temperature,instantaneous,non-contacting,anti-oxidation photonic sintering technology is described,which provides a reference for the large-scale application of flexible electronic technology.
作者
郝武昌
卢睿涵
刘振国
黄维
孟鸿
HAO Wuchang;LU Ruihan;LIU Zhenguo;HUANG Wei;MENG Hong(Xi’an Hongxing Electronic Paste Technology Co.,Ltd.,Xi’an 710065,C)
出处
《电子工艺技术》
2020年第5期256-259,共4页
Electronics Process Technology
基金
陕西省重点研发计划项目(S2019-YF-GXZD-0041)。
关键词
光子烧结
纳米铜粉
铜浆
柔性电子
photonic sintering
copper nanoparticles
copper paste
fl exible electronics
