摘要
某电子产品在工作过程中承受约10 ms、20000g的冲击加速度,对产品可靠性提出了极高要求。为保证印制板电路的抗冲击性,必须对其进行灌封和加固。选择符合要求的灌封材料,研究其灌封工艺方法,并进行仿真和实物试验,实现了电子产品的抗冲击及质量要求。通过环氧树脂灌封的电子产品抗冲击能力明显增强,该技术具有一定的实用性。
An electronic product must bear great impact acceleration of 10 ms and 20000g in the working process,which puts forward extremely high requirements for product reliability.In order to ensure the impact resistance on PCB,the PCB must be encapsulated and reinforced.By selecting suitable encapsulating materials,studying the encapsulating process and carrying out simulation and physical test,the requirements of impact resistance and quality are realized.The impact resistance of electronic products encapsulated by epoxy resin is obviously reinforced,this technology has a certain practicality.
作者
李正睿
陈恒
杨可
吴梦如
LI Zhengrui;CHEN Heng;YANG Ke;WU Mengru(Hubei Sanjiang Aerospace Red Peak Control Co.,Ltd.,Xiaogan 432000,China;Nanjing Chenguang Group Co.,Ltd.,Nanjing 210006,China)
出处
《电子工艺技术》
2020年第4期222-225,共4页
Electronics Process Technology
关键词
电子产品
高过载
灌封
环氧树脂
electronic product
high overload
encapsulating
epoxy resin
