摘要
通过电子背散射衍射(EBSD)分析Cu-Sn-P合金在冷旋压过程中的组织,发现沿着旋压件的厚度方向,从外表面到内表面,晶粒尺寸增大,外表面超细晶晶粒数量最多,内表面保留一部分原始晶界,晶粒取向呈现出随机分布状态。晶粒取向差中,沿厚度方向LGB所占比例最大,主要分布在晶粒尺寸较大区域。
The structure of the Cu-Sn-P alloy during cold spinning was analyzed by Electron Backscattered Diffraction(EBSD).It was found that the grain size increased from the outer surface.to the inner surface along the thickness of the spinning part,and the outer surface.The number of ultrafine crystal grains is the largest,and a part of the original grain boundaries is retained on the inner surface,and the grain orientation shows a random distribution state.Among the poor grain orientations,LGB accounts for the largest proportion in the thickness direction,and is mainly distributed in regions with larger grain sizes.Among poor grain orientations,the proportion of LAGB is the largest in the thickness direction,mainly distributed in the region with large grain size.
作者
邓爱民
杨久旭
刘壮
DENG Aimin;YANG Jiuxu;LIU Zhuang(Shenyang Ligong University,Shenyang 110159,China;Shenyang University Of Technology,Shenyang 110870,China)
出处
《沈阳理工大学学报》
CAS
2020年第2期64-67,共4页
Journal of Shenyang Ligong University
