摘要
环氧树脂(EP)是常用的电子封装材料,向环氧树脂中添加高导热氮化硼(BN)填料是提高环氧树脂复合材料热导率的有效方法之一。本文介绍了电子封装用环氧树脂基复合材料的导热机理,综述了近年来电子封装用环氧树脂/氮化硼复合材料的研究进展,最后展望了环氧树脂/氮化硼导热复合材料的发展前景。
Epoxy resin(EP) is a frequently-used material for electronic packaging, and it is one of the most effective approaches to improve the thermal conductivity of epoxy resin by adding boron nitride(BN) fillers with high thermal conductivity and electrical insulation into EP matrix. In this paper, the thermal conductive mechanism of EP based composites for electronic packaging was introduced, and the recent research progress in EP/BN composites for electronic packaging was reviewed. Finally, the challenges and future development of thermally conductive EP/BN composites was prospected.
作者
何亭融
曲绍宁
尹训茜
HE Tingrong;QU Shaoning;YIN Xunqian(College of Materials Science and Engineering,Shandong University of Science and Technology,Qingdao 266590,China)
出处
《绝缘材料》
CAS
北大核心
2020年第7期12-17,共6页
Insulating Materials
基金
山东科技大学人才引进科研启动基金项目(2017RCJJ016)。
关键词
环氧树脂
氮化硼
导热
电子封装
epoxy resin
boron nitride
thermal conduction
electronic packaging
