摘要
研究陶瓷与6061铝合金烧结封接工艺及其结合机制。将Al2O3陶瓷进行表面化学镀镍,再与6061铝合金进行烧结封接,在不同烧结温度下观察Al2O3(N)陶瓷/6061铝合金接头微观形貌,并选取在590℃、1 h下获得的接头进行EDS分析,测定不同温度下烧结Al2O3(N)陶瓷/6061铝合金接头强度。研究表明,所制Al2O3陶瓷表面化学镀镍层均匀致密,铝合金中元素扩散至化学镀镍层,自铝合金一侧至陶瓷一侧,Al元素含量整体上呈先减小后增大的趋势;随着烧结温度的升高,接头强度也随之升高,最大可达15.4 MPa。
This paper makes a study of the sintering process of sealing the ceramic with 6061 aluminum alloy and its binding mechanism.Electroless nickel plating is done on Al 2O 3 ceramic surface,then sintering and sealing is with 6061 aluminum alloy.The microstructure of 6061 aluminum alloy/Al 2O 3(N)ceramic is observed at different sintering temperature conditions and EDS analysis is performed on the joints at 590℃、1 h.The bonding strength is tested at different temperatures conditions.It is found that the nickel layer on the ceramic surface is uniform and compact and the elements in the aluminum alloy spread to the electroless nickel plating layer.From the aluminum alloy side to the ceramic side,the content of Al element first decreases and then increases.With the sintering temperature rise,the joint strength also increases,up to 15.4 MPa.
作者
仇天琳
张德库
熊煜婷
代珩
孙彪
王克鸿
QIU Tianlin;ZHANG Deku;XIONG Yuting;DAI Heng;SUN Biao;WANG Kehong(College of Material Science and Engineering,Nanjing University of Science and Technology,Nanjing 210094,China)
出处
《机械制造与自动化》
2020年第3期51-52,82,共3页
Machine Building & Automation
基金
国防科技创新特区项目(18-H863-03-ZD-007-004-02)。
关键词
化学镀镍
AL2O3陶瓷
6061铝合金
烧结封接
electroless nickel plating
Al2O3 ceramics
6061 aluminum alloy
sintering and sealing
